Faculty

2009.07-2012.10 Materials processing engineering, Harbin Institute of Technology, Doctorate, Ph.D.

2007.09-2009.07 Material processing engineering, master of engineering, Harbin Institute of Technology, M.S.

2002.09-2006.07 Material forming and control engineering, Harbin Institute of Technology, B.S.

1. Advanced electronic packaging materials and reliability

2. Preparation and application of metal nanoparticle inks for additive manufacturing

3. Precursor ceramic materials and devices

Publications

1. Z.H. Zhang*, M.Y. Li*, Z.Q. Liu and S.H. Yang. Growth characteristics and formation mechanisms of Cu6Sn5 phase at the liquid-Sn0.7Cu/(111)Cu and liquid-Sn0.7Cu/(001)Cu joint interfaces. Acta Mater. 2016, 104, 1-8.

2. Zhihao Zhang*, Huijun Cao, Mingyu Li*, Yuxi Yu, Haifeng Yang and Shihua Yang. Three-dimensional placement rules of Cu6Sn5 textures formed on the (111)Cu and (001)Cu surfaces using electron backscattered diffraction. Mater. Design. 2016, 94, 280-285.

3. Z.H. Zhang*, H.J. Cao, H.F. Yang, M.Y. Li* and Y.X. Yu. Hexagonal-Rod Growth Mechanism and Kinetics of the Primary Cu6Sn5 Phase in Liquid Sn-Based Solder. J. Electron. Mater. 2016, DOI: 10.1007/s11664-016-4814-9.

4. M.Y. Li*, H.F. Yang, Z.H. Zhang*, J.H. Gu and S.H. Yang. Fast formation and growth of high-density Sn whiskers in Mg/Sn-based solder/Mg joints by ultrasonic-assisted soldering: Phenomena, mechanism and prevention. SCI REP-UK. 2016, 6, 27522.

5. Huijun Cao, Yuchuan Chu, Ermeng Wang, Yong Cao*, Guangqing Xia and Zhihao Zhang*. Numerical Simulation Study on Barrel Erosion of Ion Thruster Accelerator Grid. J. Propul. Power. 2015, 31, 1785-1792.

6. Mingyu Li*, Yong Xiao, Zhihao Zhang* and Jie Yu. Bimodal Sintered Silver Nanoparticle Paste with Ultrahigh Thermal Conductivity and Shear Strength for High Temperature Thermal Interface Material Applications. ACS Appl. Mater. Inter. 2015, 7, 9157-9168.

7. Z.H. Zhang, H.J. Cao, M.Y. Li*, Y. Wang and Z.Q. Liu*. Cathodic peeling damage of Cu6Sn5 phase in Cu/SnAg3.0Cu0.5/Cu bridge interconnections under current stressing. J. Appl. Phys. 2014, 116, 054909.

8. Zhihao Zhang, Mingyu Li* and Chunqing Wang*. Fabrication of Cu6Sn5 single-crystal layer for under-bump metallization in flip-chip packaging. Intermetallics, 2013, 42, 52-55.

9. M.Y. Li*, Z.H. Zhang and J.M. Kim*. Polymorphic transformation mechanism of η and η' in single crystalline Cu6Sn5. Appl. Phys. Lett. 2011, 98, 201901.